With the continuous advancement of technology, electronic devices are becoming more and more miniaturized and integrated. In this context, low-temperature co-fired Aluminum Nitride ceramic substrates have become a rising star in electronic packaging technology with their unique advantages.
What is low-temperature co-fired Aluminum Nitride ceramic substrate
Low-temperature co-fired Aluminum Nitride ceramic substrate is a ceramic substrate carefully crafted using advanced low-temperature co-fired technology. It achieves high-integration, high-performance electronic packaging by making low-temperature sintered ceramic powder into a green porcelain tape with precise thickness and density, and then using laser drilling, micropore grouting, precision conductor slurry printing and other processes to produce the required circuit graphics on the green porcelain tape.
Application fields stand out in the electronics industry for their high frequency, high Q and microwave characteristics, especially in the production of multi-layer circuit substrates. Low-temperature co-fired Aluminum Nitride ceramic substrate is widely used in high-frequency communications, 5G communications, consumer electronics, home appliances, computers and peripherals, automobiles and other fields.
Low-temperature co-fired Aluminum Nitride ceramic substrate has low dielectric loss and is suitable for making 20~30GHz devices, meeting the needs of high-frequency communication components.
- High-density circuits
LTCC technology can be used to make high-density circuits that do not interfere with each other in three-dimensional space, and can also be used to make three-dimensional circuit substrates with built-in passive components.